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Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK

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Buy cheap Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive from wholesalers
  • Buy cheap Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive from wholesalers
  • Buy cheap Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive from wholesalers
  • Buy cheap Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive from wholesalers

Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive

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Brand Name:Ziitek
Model Number:TIA820FG
Certification:RoHs
Supply Ability:1000SQM/Day
Delivery Time:2-3Work day
Company Data
Verified Supplier
Contact Person Dana Dai
Business Type: Manufacturer
Officials: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Quality: Quality Certifitation Available
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Product Details Company Profile
Product Details

Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive


The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.


TIA800FG Series Datasheet-(E)-REV01.pdf


Features


> Thermal Conductivity: 0.8 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive


Applications


> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or clip mounting


Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive


Typical Properties of TIA™800FG Series
Product NameTIATM805FGTIATM806FGTIATM808FGTIATM810FGTIATM815FGTIATM820FGTest Method
ColorWhiteVisual
Adhesive TypeAcrylic Adhesive********
Backing TypeGlass fiber********

Composite

Thickness

0.005" 0.127mm0.006" 0.152mm0.020" 0.203mm0.010" 0.254mm0.015" 0.381mm0.020" 0.508mmASTM D374

Aluminum

Foil Thickness

±0.001" ±0.025mm±0.001" ±0.025mm±0.0012" ±0.03mm±0.0012" ±0.03mm±0.0015" ±0.038mm±0.002" ±0.05mm

ASTM D374

Voltage Breakdown> 2000 Vac> 2000 Vac> 2300 Vac> 3000 Vac> 3500 Vac> 3500 VacASTM D149
Peel Adhesion1200 g/inch2JIS K02378

Holding Power

25℃/Days

> 120 kg/inch2JIS K023711
Holding Power 120℃/Hours> 10 kg/inch2JIS K023711

Recommend

Using Pressure

10 psi********
Thermal Conductivity0.8 W/mK********

Thermal

Impedance

@50psi

0.52℃-in²/W0.59℃-in²/W0.83℃-in²/W0.91℃-in²/W1.15℃-in²/W1.43℃-in²/WASTM D5470

Standard Thicknesses:
0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.015"(0.381mm) 0.020"(0.508mm)
Consult the factory alternate thickness.

Standard Sizes:
10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M)
Individual die cut shapes can be supplied.

Reinforcement:
TIA™800 Series sheets are fiberglass reinforced.
Company Profile

Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.  

 

Ziitek D-U-N-S® Number: 656191068

 

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